In the Chinese microblog Weibo have pictures of the motherboard smartphone iPhone 5S. Distributed by the passing shots sources confirmed specs of the coming phone. The fact that insiders have told, not a novelty: Apple will not change the form factor of its flagship, and instead focus on its internal content.
Published today on the Web images show circuit board iPhone 5S, which is said to have significantly different in shape and arrangement of parts of the same component for the iPhone 5.
However, externally iPhone 5S will fit in almost all the current flagship, indicating the source. The device will receive a more productive filling: a camera with a resolution of 12 megapixels, dual LED flash, 2GB of RAM, NFC module and fingerprint sensor. Settings screen iPhone 5S, made by technology IGZO, will match the display characteristics of the iPhone 5 – 1136 x 640 pixels and a density of 326 ppi.
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